Hardware Architecture
Technical
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Silicon & Circuits
PCB Design.
Expert PCB design services covering schematic capture, stack-up planning, signal integrity analysis, and DFM optimization.
Multi-layerHDIFlex-RigidSignal Integrity
System Ready
Technical
Capabilities.
High-speed digital design (DDR5, PCIe Gen5, 400G Ethernet)
Mixed-signal and precision analog topologies
Multi-band RF and antenna array integration
Rigid, flex, and complex rigid-flex fabrics
HDI with stacked microvias and laser-drilled blind vias
Time-domain and frequency-domain SI/PI analysis
The Trace Philosophy
Every micrometer of copper is an opportunity for signal optimization. We treat PCB layout as a multidimensional physics simulation from the first via.
- SI/PI simulations for every critical net before first prototype
- Thermal intelligence through copper pour optimization and via farming
- Stack-up symmetry engineered to minimize warpage in reflow and assembly
Core Focus
Multi-layer, HDI, Flex-Rigid — delivering measurable impact through deep technical expertise.
Engagement Model
From discrete consulting engagements to full turnkey delivery, we adapt to your program's specific needs and timeline.
Deep Tech FAQ
What is the maximum layer count you support?+
We design up to 32-layer HDI PCBs with stacked microvias, blind/buried vias, and laser-drilled via-in-pad technology for high-density digital and RF applications.
Do you provide DFM analysis?+
Yes. DFM analysis is integrated into our design workflow, covering solder mask expansion, copper balance, annular ring requirements, and panel utilization optimization to ensure first-pass manufacturing success.
ChipTalk.AI Advantage
ChipTalk's PCB design team has taped out over 200 unique board designs across automotive, aerospace, medical, and consumer verticals. We treat every board as a high-speed, high-reliability challenge regardless of layer count, and our signal-integrity-first workflow catches impedance discontinuities and crosstalk violations before the first prototype is fabbed.
Related Engagements
01
AI Accelerator Module
Designed a 28-layer PCIe Gen5 add-in card with 112 Gbps PAM4 SerDes, managing 30+ differential pairs with <1 dB insertion loss variance across the link.
02
Portable Ultrasound Mainboard
Developed a 16-layer mixed-signal board with 64-channel analog front-end, achieving 88 dB SNR and passing IEC 60601 EMI compliance on the first pass.
Our DFM-integrated workflow—including IPC-6012 class 3 compliance, automated DFM rule checks, and panel-optimized stack-ups—consistently delivers first-pass prototype success rates above 85%.
Relevant Tags:Multi-layerHDIFlex-RigidSignal Integrity